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Strong cooling capability: heat flux removal can reach 400 W/cm2. Its cooling capability is 1000 times that of forced water cooling and 100 times that of heat pipe Surface temperature uniformity is within ±2℃. compared with the traditional heat sink the product is 50% lighter and 20% smaller. No power consumption with Passive cooling without fan or pump. . simple, compact, stable and easy to start up. Reliability is much higher than that of fan cooler, forced water cooler system. . suitable for SMD CREE LEDS OR COB LEDS on your any design. |
with strong heat removal and thermal dissipation ability by using micro-groove phase technlogy.
new patented advanced led cooer technology is our microgroove combined phase changed cooling technology ,it is best coolling than recent any other cooler heat sink .
Cooling is conducted using the mechanism of combined phase-change heat transfer in high density micro-groove structure. Combined phase-change occurs when the liquid media in the structure accumulate sufficient heat. This mechanism significantly enhances the capability of heat removal, transfer and exchange. Also, the thermal diffusion with isothermal phase-change combines the evaporation and the cooling in the heat sink without any power consumption.
Model Power(W) Weight(kg) Diameter of the mounting plate(mm) Temperature rise(℃) S-160-40 S -160-40D 40～50 0.4/0.6 80/116 ≤29℃～≤37℃ S -160-75 S -160-75D 60～80 0.8/0.95 80/116 ≤29℃～≤37℃ S -160-100D 80～100 1.2 80/116 ≤35℃～≤39℃ S -160-150D 100～120 1.8 80/116 ≤31℃～≤37℃ S -160-225D 120～150 2.5 80/116 ≤32℃～≤34℃ 
