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Strong cooling capability: heat flux removal can reach 400 W/cm2. Its cooling capability is 1000 times that of forced water cooling and 100 times that of heat pipe Surface temperature uniformity is within ±2℃. compared with the traditional heat sink the product is 50% lighter and 20% smaller. No power consumption with Passive cooling without fan or pump. . simple, compact, stable and easy to start up. Reliability is much higher than that of fan cooler, forced water cooler system. . suitable for SMD CREE LEDS OR COB LEDS on your any design.
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Cooling is conducted using the mechanism of combined phase-change heat transfer in high density micro-groove structure. Combined phase-change occurs when the liquid media in the structure accumulate sufficient heat. This mechanism significantly enhances the capability of heat removal, transfer and exchange. Also, the thermal diffusion with isothermal phase-change combines the evaporation and the cooling in the heat sink without any power consumption.
low temperature rise and lower junction temperature on leds while working .
more cooling fins to conduct the heat very fast from inside to outside . conduct the heat from the chip PCB to the cooling fins rapidly fast ,so the chip temperature is extremely lower , effectively improve the chip antioxidant function,
long lifespan, pure color.
and the weight is more lighter 30%--50% than traditional cooler heat sink .
Outline drawing：S-90（A series）：
